Power chips are attached to external circuits through packaging, and their efficiency depends upon the support of the product packaging. In high-power situations, power chips are generally packaged as power modules. Chip interconnection refers to the electric connection on the top surface area of the chip, which is generally light weight aluminum bonding wire in conventional components. ^
Typical power component bundle cross-section
Presently, business silicon carbide power modules still mostly make use of the product packaging innovation of this wire-bonded typical silicon IGBT component. They deal with issues such as large high-frequency parasitic specifications, not enough warm dissipation capacity, low-temperature resistance, and not enough insulation toughness, which restrict using silicon carbide semiconductors. The display of exceptional efficiency. In order to address these troubles and totally manipulate the huge possible advantages of silicon carbide chips, lots of new product packaging technologies and remedies for silicon carbide power modules have emerged recently.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually established from gold wire bonding in 2001 to aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually established from gold wires to copper cables, and the driving force is cost decrease; high-power tools have developed from light weight aluminum cables (strips) to Cu Clips, and the driving force is to improve item efficiency. The greater the power, the higher the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that uses a strong copper bridge soldered to solder to connect chips and pins. Compared with standard bonding product packaging methods, Cu Clip innovation has the following benefits:
1. The link between the chip and the pins is made of copper sheets, which, to a certain level, changes the standard cable bonding technique between the chip and the pins. For that reason, an unique bundle resistance worth, higher existing flow, and far better thermal conductivity can be obtained.
2. The lead pin welding location does not require to be silver-plated, which can fully conserve the price of silver plating and poor silver plating.
3. The item look is completely consistent with regular products and is primarily made use of in servers, mobile computers, batteries/drives, graphics cards, electric motors, power materials, and other fields.
Cu Clip has two bonding techniques.
All copper sheet bonding technique
Both the Gate pad and the Resource pad are clip-based. This bonding approach is more expensive and intricate, yet it can accomplish far better Rdson and better thermal impacts.
( copper strip)
Copper sheet plus wire bonding method
The source pad uses a Clip method, and the Gate makes use of a Cord method. This bonding technique is slightly less costly than the all-copper bonding technique, conserving wafer location (relevant to really tiny gate areas). The procedure is simpler than the all-copper bonding method and can acquire far better Rdson and far better thermal effect.
Provider of Copper Strip
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